Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
نویسندگان
چکیده
منابع مشابه
Copper/solder intermetallic growth studies.
Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for approximately 2.5 h at 170 degrees C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffu...
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Solidification needs an undercooling to drive the solidification front. If large undercoolings are achieved, metastable solid materials are solidified from the undercooled melt. Containerless processing provides the conditions to achieve large undercoolings since heterogeneous nucleation on container walls is completely avoided. In the present contribution both electromagnetic and electrostatic...
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In this study, we used microstructure evolution and electron microprobe analysis (EPMA) to investigate the interfacial reactions in Sn-Zn and Sn-Zn-Al solder balls with Au/Ni surface finish ball-grid-array (BGA) bond pad over a period of isothermal aging at 150°C. During reflow, Au dissolved into the solder balls and reacted with Zn to form g-Au3Zn7 and g2-AuZn3. As aging progressed, g and g2 t...
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ژورنال
عنوان ژورنال: Korean Journal of Metals and Materials
سال: 2016
ISSN: 1738-8228,2288-8241
DOI: 10.3365/kjmm.2016.54.12.908